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锡焊技术过去对工业的发展起到了其他技术不可代替的作用,在电子制造装联技术中得到广泛应用。由于铅对环境的污染,人们开始对无铅锡焊技术进行了研究。无铅化已成为电子制造锡焊技术不可逆转的潮流,近些年,国内无铅已进入实施阶段,许多企业正在进入无铅化的实施中。今后无铅焊接及其应用在电子制造业将取得重大进展并将取代有铅焊接技术。一.手工锡焊焊接原理目前电子元器件的焊接主要采用锡焊技术。锡焊技术采用以锡为主的锡合金材料作焊料,在一定
Soldering technology in the past on the industrial development has played an irreplaceable role in other technologies, in the electronic manufacturing and assembly technology has been widely used. Due to lead pollution of the environment, people began to lead-free solder technology was studied. Lead-free has become an irreversible trend in soldering technology for electronic manufacturing. In recent years, lead-free has entered the implementation stage in China, and many enterprises are entering the implementation of lead-free technology. Future lead-free soldering and its applications in the electronics manufacturing industry will make significant progress and will replace lead soldering technology. I. Manual soldering welding principle At present, the soldering of electronic components mainly soldering technology. Solder technology using tin-based tin alloy solder material, at a certain