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IC的飞速发展,推动着封装技术不断前行。尤其是时下,智能手机、自动驾驶、网络安全、存储/服务器等应用的爆发对高性能IC及先进封装技术提出了更高的要求。据咨询公司Tech Search International预测,先进封装技术——扇出晶圆级封装(FOWLP)从2015年到2020年将达到82%的增长。一方面,半导体行业亟需先进封装技术,但另一方面,行业普遍使用的仍然是面向PBGA(plastic ball grid
The rapid development of IC, packaging technology continues to move forward. Especially nowadays, the outbreak of applications such as smart phones, autonomous driving, network security, storage / servers and the like has set higher demands on high-performance ICs and advanced packaging technologies. According to consulting firm Tech Search International, FOWLP, an advanced packaging technology, is expected to grow 82% between 2015 and 2020. On the one hand, the semiconductor industry urgently needs advanced packaging technology, but on the other hand, the industry is still commonly used for PBGA (plastic ball grid