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90年代,片状元件表面组装技术将成为国际电子工业锡焊技术的主流。我国电子工业锡焊技术也将向更小型化、超微细化的精密锡焊技术方向发展,这就对锡焊料、焊丝的生产提出了更高的要求。上海振兴有色金属技术工程部课题组参照国外有关技术标准,结合国内电子工厂的现状,利用波峰焊失效焊料,经过反复试验、应用,最近研制成功一种含有微量元素的含铜焊锡丝,为同家填补了锡—铅—铜焊丝空白。该种含铜焊锡丝系利用波峰焊失效焊料加工而成,这样为电子工厂失效焊料的合理
90’s, chip components surface assembly technology will become the international electronics industry, the mainstream of soldering technology. China’s electronics industry soldering technology will also be more miniaturization, ultrafine precision solder technology direction, which on the tin solder, wire production put forward higher requirements. Shanghai Zhenxing Nonferrous Metal Technology Engineering Group’s research group with reference to the relevant foreign technical standards, combined with the status of the domestic electronics factory, the use of wave soldering failure solder, after repeated testing, application, recently developed a trace element containing copper solder wire for the same Home filled tin-lead-copper wire blank. This kind of copper-containing solder wire is processed by wave soldering failure solder, so that the failure of the electronic factory solder is reasonable