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电子爱好者要拆焊SMD(表面贴片)元件是很麻烦的事,现介绍一些拆焊经验,供读者参考。SMD的拆卸1.切割法:如果确定元件已经损坏则用此法,特别是对于那些四方多脚SMD(如CXD2526IC等)元件此法最好。但要注意在割IC引脚前把IC四边的脚与铜箔接触部分焊上锡(焊厚些),这样做是防止在割引脚时,被割的引脚与铜箔相对移位,揭起铜箔。割引脚要用锋利的刀,而且尽可能快,以避免铜箔移位。在割完后用较薄
Electronic enthusiasts want to desoldering SMD (surface mount) components is a very troublesome thing, is to introduce some of the desoldering experience for readers reference. SMD disassembly 1. Cutting method: If you determine the components have been damaged using this method, especially for those four-foot multi-foot SMD (such as CXD2526IC, etc.) This method is best. However, we should pay attention to cut the IC pin before the four sides of the IC and the copper contact with the solder on the part of the solder (welding thick), this is to prevent the cutting pin, the pin is cut and copper relative displacement, exposing From the copper foil. Use a sharp knife to cut the pins and try to avoid the foil shifting as fast as possible. Use thinner after cutting