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1课题摘要电子行业的无铅环保要求,推动了填料在覆铜板行业中的应用,使用填料技术已成为提升覆铜板性能的重要手段,填料在覆铜板行业应用的发展趋势是其含量的不断提升。由于填料表面为惰性,填料含量的提升会造成铜箔与热固性树脂组合物的粘合力下降,这是本行业普遍存在的难题。本论文采用创新方法,打破惯性思维,发明了一种非均匀的复合材料的制作方法和工艺。利用一种二次上胶
1 Summary of topics The lead-free environmental requirements of the electronics industry to promote the application of filler in the CCL industry, the use of filler technology has become an important means to enhance the performance of CCL, filler in the CCL industry development trend is its increasing content . Due to the inert nature of the filler surface, the increase in filler content will result in a decrease in the adhesion of the copper foil to the thermosetting resin composition, which is a pervasive problem in the industry. In this dissertation, an innovative method is adopted to break the inertia and to create a non-uniform composite material manufacturing method and process. Use a secondary glue