彩电专用与通用IC的检测、选用与代换(二)

• 作 者: 于家陆
• 出 处: 家电检修技术
• 发表日期: 2012年22期
• 关键词: 引脚封装 引脚 集成电路 引脚排列 栅格 阵列 电路板 多层的 阵列式 彩色电视机

(3)球形栅格阵列内引脚封装球形栅格阵列内引脚封装又称BGA封装,是一种多层的芯片载体封装。这类封装的引脚在集成电路的“肚皮”底部,引线是以阵列的形式排列的,其引脚是按行线、列线来区分,所以引脚的数目远远超过分布在封装外围的引脚。利用阵列式封装,可以省去电路板多达约70%的位置,其引脚排列如图3(b)、图3(c)、图3(d)所示(图

(3) Ball grid array pin package Ball grid array pin package, also known as BGA package, is a multi-layer chip carrier package. The pins of this type of package are at the bottom of the “belly” of the IC. The leads are arranged in an array. The pins are separated by row and column lines, so the number of pins far exceeds the number of pins Peripheral pins. With the array package, up to about 70% of board space can be dispensed with, with pinouts shown in Figure 3 (b), Figure 3 (c), and Figure 3 (d)