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金属的电抛光应用越来越广泛.但电抛光机理至今仍不很清楚.我们曾用 XPS 和AES 研究了不同槽电压下电抛光铜表面的组成和物种,确认其表面均为纯铜,不存在含磷固体膜.本文用 XPS 研究电抛光液中1-羟基乙叉-1,1-膦酸(HEDP)浓度、抛光液的 pH 及其接受体(H_3PO_4,HEDP 和 HEDP+H_3PO_4)变化时铜的表面组成,并进一步证明,电抛光时形成的粘液膜是水溶性膜,铜表面在不同抛光条件下并不形成难溶的含磷固体膜.通过电子能谱对固化后粘液膜组成和深度分布的研究确定,粘液膜可能是铜的多核聚合混合配体配合物,其组成可近似地表示为[Cu_4(PO_4)(HEDP)]_n.
Electro-polishing of metal is more and more widely used, but electropolishing mechanism is still not clear yet.We have studied the composition and species of electro-polished copper surface under different cell voltage with XPS and AES, The existence of phosphorus-containing solid film.In this paper, the concentration of 1-hydroxyethylidene-1,1-phosphonic acid (HEDP), the pH of the polishing solution and its acceptor (H_3PO_4, HEDP and HEDP + H_3PO_4) Copper surface composition and further evidence that the electro-polishing mucus membrane is a water-soluble film, the copper surface under different polishing conditions does not form a poorly soluble phosphorus-containing solid film by electron spectroscopy on cured mucus membrane composition and The study of depth distribution confirmed that the mucous membrane may be a multi-core polymeric mixed ligand complex of Cu, whose composition can be approximated as [Cu_4 (PO_4) (HEDP)] _ n.