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本文讨论了树脂封装的功率晶体管的特性,即成形性,热膨胀系数、吸水性、透水性,热变形、热传导、热稳定性及体电阻等。目前所采用的树脂封装,是可达大约20～30瓦的功率晶体管。当 Pc=600毫瓦以上,T_1=150℃时主要是采用硅酮树脂,在600毫瓦以下,T_1=150℃时主要是采用环氧树脂,复盖晶体管主要是采用硅酮树脂。在树脂封装中,普遍采用使液态、粉末态及粉末成形了的块状材料及递模封装法。
This article discusses the characteristics of resin-encapsulated power transistors, namely formability, coefficient of thermal expansion, water absorption, water permeability, thermal deformation, thermal conductivity, thermal stability and body resistance. Currently used resin package, is up to about 20 to 30 watts of power transistors. When Pc = 600 milliwatts, T_1 = 150 ℃, the main use of silicone resin, at 600 milliwatts, T_1 = 150 ℃ mainly epoxy resin, cover the main use of silicone resin transistor. In resin encapsulation, a bulk material and a mold encapsulation method for forming liquid, powdery and powdery powders are commonly used.