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金刚石/铜复合材料(Diamond/Cu)的界面层相比基体与增强体有显著的化学成分变化,具有促进彼此结合、传递载荷的作用。Diamond/Cu复合材料作为热管理材料,热导率是一个关键性能参数。在众多影响因素中,界面对热导率的影响尤为重要。主要研究Diamond/Cu复合材料的界面组成,及成分梯度分布情况。通过扫描电子显微镜(SEM)观察复合材料断口形貌和界面区碳化铬的形态及分布,在近铜端,发现碳化铬以类鳞片状随机零散分布于铜与界面层的互扩散区,界面层处则集中堆垛为层状;采用能谱分析测试仪(EDS)对金刚石/铜复合材料界面区进行元素分布分析,发现各元素具有明显的过渡区域,根据实验结果可估算出过渡区域大约厚700 nm,碳化铬层大约厚400 nm;利用X射线衍射仪(XRD)对金刚石/铜复合材料的界面层进行物相分析,研究表明Diamond/Cu Cr复合材料中界面反应生成的碳化铬以3种形式存在,分别为Cr3C2,Cr7C3,Cr23C6。通过这些实验手段获取界面信息,如界面类型、界面结构、界面组成等,为进一步深入研究Diamond/Cu复合材料界面与性能的关系奠定坚实基础。
The diamond / Cu interfacial layer has significant chemical composition change compared with the matrix and the reinforcement, which has the effect of promoting the bonding and transferring the load. Diamond / Cu composites as thermal management materials, thermal conductivity is a key performance parameter. Among many influencing factors, the influence of interface on thermal conductivity is particularly important. The main research diamond / Cu composites interface composition, and composition gradient distribution. The fracture morphology and distribution of chromium carbide in the interface area were observed by scanning electron microscopy (SEM). Near the copper end, chromium carbide was found to be randomly scattered in the flake-like shape in the interdiffusion region between the copper and the interface layer. The interface layer At the same time, EDS was used to analyze the elemental distribution of diamond / copper composites. The results showed that each element had obvious transitional area. Based on the experimental results, it was estimated that the transition area was about 700 nm, and the chromium carbide layer is about 400 nm thick. Phase analysis of the interfacial layer of the diamond / copper composites by X-ray diffraction (XRD) shows that the interfacial reaction between the carbides and carbides of the diamond / Species exist, namely Cr3C2, Cr7C3, Cr23C6. The interface information, such as interface type, interface structure and interface composition, are obtained through these experimental methods, which lays a solid foundation for further study on the relationship between interface and performance of Diamond / Cu composites.