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随着去年Dialog取得了台湾敦宏科技40%的股份后,国际Fabless业者Dialog于今日又有重要动作。此次的重大发布是与晶圆代工龙头台积电(TSMC)在GaN(氮化镓)元件的合作。透过台积电以六寸晶圆厂的技术,Dialog推出了DA8801,Dialog企业发展及策略资深副总裁Mark Tyndall在会后接受CTIMES采访时表示,该款元件为目前产业界首款将逻辑元件与GaN FET整合为单一晶片的产品。而台积电在六寸晶圆厂所采用的作法,是在硅基板上堆叠GaN层,再进一步量产出这款DA8801功率元件。Dialog与台积电的合作并不是今天才开始,双方就混合讯号与电源管理上,就已经有相当长的一段时间。
Dialog, an international Fabless operator, has another major move today as Dialog acquired a 40% stake in Taiwan’s Dunhong Technology last year. The major announcement is the cooperation with wafer foundry TSMC in GaN (gallium nitride) components. Through TSMC’s six-inch fab technology, Dialog introduced the DA8801. Mark Tyndall, senior vice president of enterprise development and strategy at Dialog, told CTIMES after the conference that the device is the first in the industry to integrate logic elements with GaN FET integrated into a single-chip product. The TSMC in the six-inch wafer fab approach adopted is stacked on the silicon substrate GaN layer, and then further mass production of this DA8801 power components. Dialog and TSMC cooperation is not the beginning of today, the two sides on the mixed signal and power management, it has been a long period of time.