【摘 要】
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德国纽伦堡,2014年5月20日-SEMITOPPress-Fit作为一种焊接安装的替代方案扩展了SEMITOP的产品系列。Press-Fit式安装可确保一步到位地将模块方便、快捷地安装到PCB上,通
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德国纽伦堡,2014年5月20日-SEMITOPPress-Fit作为一种焊接安装的替代方案扩展了SEMITOP的产品系列。Press-Fit式安装可确保一步到位地将模块方便、快捷地安装到PCB上,通过取消焊接过程,减少了装配时间和成本。该产品与焊接版本100%引脚兼容,提供了一个用户友好的press-fit接口。此外,SEMITOP Press-Fit模块与现有的焊接版本具有相同的电气性能和热性能,使得采用SEMITOP系列产品切换到press-fit安装技术最为容易。SEMITOP Press-Fit是基于无基板技术的绝缘型功率模块,散热器的固定
Nuremberg, Germany, 20 May 2014 - SEMITOPPress-Fit expands the product range of SEMITOP as an alternative to soldering and mounting. Press-Fit mounting ensures that the module can be quickly and easily mounted to the PCB in one step and assembly time and costs are reduced by eliminating the welding process. The product is 100% pin compatible with the soldered version and offers a user-friendly press-fit interface. In addition, SEMITOP Press-Fit modules offer the same electrical and thermal performance as existing solder versions, making it easy to switch to press-fit mounting technology with the SEMITOP family of products. SEMITOP Press-Fit is an insulation-based power module without base technology, heat sink fixing
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