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薄膜材料的研究为许多领域提供了新颖的功能材料,发展了新型的功能器件。本文旨在着重介绍近年来薄膜型压力、温度、光敏、色敏、磁敏的国内外研究与开发现状。 1 薄膜型压力敏感元件 1.1 多晶硅、微晶硅压力敏感元件 国外,美国威斯康森大学在有预设氧化隔离层的硅衬底上,采用LPCVD技术淀积微晶粒多晶硅膜,制成压敏电阻。由于器件是全硅结构,消除了膨胀系数不同的影响,在工艺上取消了正反面对准和KOH腐蚀;以薄膜技术,得到严格的尺寸容差,并已研制出具有12×12阵列、量程为一个大气压的器件。
Research in thin-film materials has provided novel functional materials in many fields and developed new functional devices. The purpose of this paper is to highlight the current research and development of membrane pressure, temperature, light sensitivity, color sensitivity and magnetism sensitivity in recent years. 1 film pressure sensitive components 1.1 polysilicon, microcrystalline silicon pressure sensitive components Foreign, the United States of America Wisconsin University in the pre-set oxide isolation layer on the silicon substrate, the use of LPCVD deposition of microcrystalline polysilicon film, made of pressure Sensitive resistance. As the device is all-silicon structure, eliminating the impact of different coefficients of thermal expansion, the process was canceled front and back alignment and KOH corrosion; thin film technology, to obtain strict size tolerance, and has developed a 12 × 12 array, Range for the atmospheric pressure of the device.