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一、绪言利用β粒子与不同物质的相互作用而产生的反散射,可以测定镀层的厚度。这是放射性同位素在工业上应用的一个重要方面。目前,我国半导体器件底座的表面一般都要镀金,而镀金的厚薄直接影响产品的质量。如果镀层厚薄不一,可能给内部铝引线的焊接造成困难,并且还会降低器件的耐腐蚀性,引起管脚断裂等弊病;如果镀金太厚,将耗费大量的贵金属,也是生产上不许可的。但是,国内半导体器件镀金层厚度的测
I. INTRODUCTION The backscatter created by the interaction of the beta particles with different materials allows the thickness of the coating to be measured. This is an important aspect of the industrial application of radioisotopes. At present, the surface of China’s semiconductor device base generally have to be gold-plated, and the thickness of gold-plated products directly affect the quality. If the coating thickness varies, it may cause difficulties for the internal aluminum lead soldering, and will also reduce the corrosion resistance of the device, causing the rupture of pins and other ills; if the gold is too thick, it will cost a lot of precious metal, but also the production is not allowed . However, the thickness of the domestic semiconductor device gold plating measurement