论文部分内容阅读
采用电子束物理气相沉积(EB-PVD)制备了纳米钼颗粒弥散强化铜基复合材料(Mo体积含量为2.5%~10.8%),对其材料微观结构、钼含量和硬度、电阻率关系进行了研究。结果表明:Cu-Mo复合材料中铜基体由柱状晶铜组成,Mo颗粒平均直径为2.4~8.1 nm;随着钼含量增加,铜基体柱状晶宽度逐渐减小,Mo颗粒平均直径逐渐增加,硬度、电阻率逐渐增加;EB-PVD制备的Cu-Mo复合材料主要强化机制为Orowan机制。
The nano-molybdenum particle dispersion strengthened Cu matrix composites (2.5% -10.8% Mo) were prepared by electron beam physical vapor deposition (EB-PVD). The relationship between the microstructure, Mo content and hardness and resistivity the study. The results show that the copper matrix in the Cu-Mo composites is composed of columnar copper and the average diameter of Mo particles is 2.4 ~ 8.1 nm. With the increase of molybdenum content, the width of the columnar crystals decreases gradually and the average diameter of Mo particles gradually increases. The hardness , The resistivity gradually increased; the main strengthening mechanism of Cu-Mo composites prepared by EB-PVD was Orowan mechanism.