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在铜基材上采用电化学浸镀技术沉积银已成为当今一项热门技术。研究采用了含有添加剂的乙醇溶液作为镀液,沉积的银采用场发射扫描电子显微术(FESEM)和原子力显微术(AFM)加以表征。研究表明,采用乙醇基镀槽制备的浸银层具有很强的表面轮廓覆盖能力,在铜基材的凸台区覆盖的银粒子尺寸为15nm左右,而在低凹区的银粒子的尺寸为10nm左右。
The deposition of silver on electro-chemical immersion plating on copper substrates has become a hot technology today. The study used an ethanol-containing solution as a plating solution and the deposited silver was characterized by field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The results show that the immersion silver layer prepared by ethanol-based plating bath has strong surface profile coverage, the size of the silver particles covered by the boss region of the copper substrate is about 15 nm, and the size of the silver particles in the depressed region is About 10nm.