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美国安可科技(Amkor Technology)与美国德州仪器(TI)宣布,共同开发出了利用窄间距铜柱凸点连接芯片与封装底板的倒装芯片封装,并已开始生产。据称,使用铜柱凸点比原来利用焊料凸点可缩小凸点间距,因而可应对伴随芯片微细化而产生的I/O密度增加问题。另外,通过优化铜柱凸点的配置,与普通的面积阵列型倒装芯片封装相比,可削减封装底板的层数,因而还能降低
Amkor Technology (USA) and Texas Instruments (TI) of the United States announced that they have jointly developed a flip chip package that uses narrow pitch copper stud bumps for connection to the package backplane and has started production. Allegedly, the use of copper stud bump than the original use of solder bumps can reduce the bump pitch, which can cope with chip miniaturization and I / O density increases. In addition, by optimizing the arrangement of the copper stud bumps, the number of layers of the package backplane can be reduced as compared with a conventional area-array flip-chip package, thereby reducing