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由于微米/纳米机电系统(MEMS/NEMS)尺寸方面的特点和制造方面的原因,当对其施加一静电场时,它除了受到静电力外还不可避免地受到真空量子效应力(Casimir力)和残余应力的作用。在这3种力的联合作用下,其变形行为也变得极为复杂。本文导出了微米/纳米微机电系统中桥式薄膜结构在这3种力联合作用下的挠度解析表达式。在不同条件下对其解进行了分析讨论。结果表明:大的残余拉应力将促使微桥薄膜的挠度出现波状行为。
Due to the size and manufacturing characteristics of the MEMS / NEMS, when it is applied with an electrostatic field, it is inevitably subjected to vacuum quantum effect force (Casimir force) and electrostatic force The role of residual stress. In the joint action of these three kinds of forces, the deformation behavior has also become extremely complicated. In this paper, we derive the analytical expression of the deflection of the bridge membrane structure under the combined action of these three forces in a micro / nano-MEMS system. Under different conditions, its solution is analyzed and discussed. The results show that large residual tensile stress will cause undulation behavior of the micro-bridge membrane.