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随着电子工业的发展,导电粘合剂的应用也日益广泛。目前国内外使用的导电粘合剂主要是以银粉为填料、合成树脂为粘合剂的复合型导电粘合剂。这种导电粘合剂形成的胶层、虽有化学稳定性好,导电性能优异等优点,但价格昂贵,银原子容易产生迁移,因此应用范围受到了一定的限制。近几年来,日本和欧美各国正在大力发展以铜粉为填料的导电粘合剂。本文介绍了以铜粉为填料的导电粘合剂的配制、性能、以及影响电导率和粘结强度的因素。本粘合剂由电解铜粉、环氧树脂以及固化剂、抗氧剂、偶联剂等按不同比例配制而成。具有成本低、导电性能好、粘结强度高等特点,适用于对铝、铜、玻璃、陶瓷以及酚醛一环氧玻璃布层压板等材料的粘接。由于在粘合剂中加有适量的抗氧剂和偶联剂,克服了铜粉易氧化的缺点,从而提高了导电粘合剂的稳定性并对导电性能有所改善。在研制过程中,并应用红外光谱分析、X—射线广角衍射等对粘合剂的结构进行了初步探讨。结果表明、以铜粉为填料的导电粘合剂具有导电性好、性能稳定、成本低等优点。其体积电阻系数为10~(-3)～10~(-4)Ω—cm,抗剪强度达85kg/cm~2,成本仅为以银粉为填料的导电粘合剂的4％左右。由于以铜粉为填料的导电粘合剂较以银粉为填料的导电粘合剂的成本大大降低,而且综合性能良好,因而具有广阔的应用前景。
With the development of the electronics industry, the application of conductive adhesives is also increasingly widespread. Currently used conductive adhesive at home and abroad mainly silver powder as filler, synthetic resin adhesive composite conductive adhesive. Although the adhesive layer formed by the conductive adhesive has the advantages of good chemical stability and excellent electrical conductivity, the adhesive layer is expensive and the migration of silver atoms easily occurs. Therefore, the application range is limited. In recent years, Japan and countries in Europe and the United States are vigorously developing conductive adhesives with copper powder as filler. This article describes the formulation, performance, and the factors that affect conductivity and bond strength of copper-based conductive adhesives. The adhesive is made of electrolytic copper powder, epoxy resin and curing agent, antioxidant, coupling agent and the like in different proportions. With low cost, good electrical conductivity, high bond strength, suitable for aluminum, copper, glass, ceramics and phenolic epoxy glass cloth laminate materials such as bonding. Due to the proper amount of antioxidants and coupling agents in the adhesive, the defects of easy oxidation of the copper powder are overcome, thereby improving the stability of the conductive adhesive and improving the conductivity. In the development process, and the application of infrared spectroscopy, X-ray wide-angle diffraction, the structure of the adhesive was discussed. The results show that the conductive paste with copper powder as filler has the advantages of good electrical conductivity, stable performance and low cost. The volume resistivity is 10 -3 to 10 -4 Ω-cm, the shear strength is up to 85 kg / cm 2, and the cost is only about 4% of the conductive adhesive filled with silver powder. As the cost of conductive adhesive with copper powder as filler is much lower than the cost of conductive adhesive with silver powder as filler, and the overall performance is good, so it has broad application prospects.