First Call for Papers 2014 International Conference on Brazing,Soldering and Special Joining Technol

• 出 处: 材料工程
• 发表日期: 2013年12期
• 关键词: ceramics packaging ceramic joining ultrasonic

Call for Papers·Joining of ceramics and ceramic matrix composites(CMCs)·Joining of intermetallics and superalloys·Micro-and nano-joining technologies·Lead-free solders and electronic packaging technologies·Special joining technologies such as laser brazing,electron-beam brazing,ultrasonic brazing,etc.·Modeling and simulation·Joint reliability evaluation Abstract and manuscript should be submitted in English,Microsoft WORD,and in A4 format.Contact us for templates of the abstract and manuscript by email:[e-mail] are normally be 3-6 printed pages in length.Please send your abstract and manuscript to brazing [e-mail].

Call for Papers • Joining of ceramics and ceramic matrix composites (CMCs) • Joining of intermetallics and superalloys • Micro-and nano-joining technologies • Lead-free solders and electronic packaging technologies • Special joining technologies such as laser brazing, electron-beam brazing , ultrasonic brazing, etc. · Modeling and simulation · Joint reliability evaluation Abstract and manuscript should be submitted in English, Microsoft Word, and in A4 format. Contact us for templates of the abstract and manuscript by email: [e-mail] are normally be 3-6 printed pages in length. Please send your abstract and manuscript to brazing [e-mail].