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研究了热处理对Cu-3.0Ni-0.75Si-0.3Co合金电导率、硬度和组织演变规律的影响,并探讨了合金的强化机理。结果表明,随固溶温度升高,合金的晶界和晶内的Ni3Si2和CoSi相粒子数量逐渐减少,合金的过饱和固溶度不断增大。在950℃×1h固溶后,由于第二相粒子的尺寸较小、数量很少,在扫描电镜图片中出现的第二相粒子未能在XRD图谱中发现,说明在950℃×1h固溶处理后溶质元素能较为充分溶于基体中。经950℃×1h固溶处理和60%的冷变形后,电导率随时效时间的延长而升高,之后趋于平稳。随着时效温度的升高,电导率也不断提高;硬度随时效时间的延长先升高,后降低;时效温度越高,到达峰值所需的时间越短。在950℃×1h固溶处理,经60%的冷变形,450℃×6h时效处理后,合金的综合性能较好,此时,合金硬度(HB)为257,电导率为20.18 MS/m。
The effects of heat treatment on the electrical conductivity, hardness and microstructure evolution of Cu-3.0Ni-0.75Si-0.3Co alloy were studied, and the strengthening mechanism of the alloy was also discussed. The results show that as the solution temperature increases, the number of Ni3Si2 and CoSi phase grains in the grain boundaries and in the grain gradually decrease, and the supersaturated solid solubility of the alloy increases. After solution treatment at 950 ℃ for 1h, the second-phase particles appeared in the SEM images were not found in the XRD pattern due to the small size and small number of the second-phase particles, indicating that the solid solution at 950 ℃ for 1h After treatment solute elements can be more fully dissolved in the matrix. After 950 ℃ × 1h solution treatment and 60% cold deformation, the conductivity increased with the aging time, then stabilized. As the aging temperature increases, the electrical conductivity also increases continuously; the hardness increases first and then decreases with the aging time; the higher the aging temperature, the shorter the time required to reach the peak value. After the solution treatment at 950 ℃ for 1h, the alloy has better overall performance after 60% cold deformation and 450 ℃ × 6h aging treatment. At this time, the hardness of alloy (HB) is 257 and the conductivity is 20.18 MS / m.