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一、概述电子元器件引线可焊性镀(涂)层的制作方法,主要有电镀法(ET)及热涂法(HD)。从镀(涂)层与引线基体的结合本质上分类,ET法属堆积(built—up)结合,HD法则为渗透(built—in)结合。由于这两种方法各有其优缺点及适用范围,因此,近几十年来,世界各国对此两种方法均不断进行着大量的试验研究,推动这一技术的发展。热涂法与电镀法相比,其主要优点是:①生产效率高;②设备维护及操作简便;③容易获得合金涂层及复合金属涂层;④涂层较致密;⑤对环境污染小……等。而其主要缺点为:①涂层的同心度及均匀性差,据某些国
First, an overview of electronic components lead solderability plating (coating) layer of production methods, mainly electroplating (ET) and thermal coating (HD). From the combination of the plating (coating) layer and the lead substrate, the ET method is built-up bonded and the HD method is built-in bonded. Since these two methods each have their own advantages, disadvantages and scope of application, in recent decades, countries all over the world have conducted extensive experimental studies on both methods to promote the development of this technology. Compared with the electroplating method, the main advantages of the thermoforming method are: ① high production efficiency; ② equipment maintenance and easy operation; ③ easy access to alloy coating and composite metal coating; ④ coating is more compact; ⑤ little environmental pollution ... Wait. The main drawbacks are: ① coating concentricity and uniformity is poor, according to some countries