论文部分内容阅读
硅成集成电路６月１１日宣不其跨足无线通讯领域的首颗芯片——ＩＣ９０００正式上市。ＩＣ９０００为硅成首颗蓝芽基频芯片,并于５月１７日通过ＴＵＶ的ＢＱＢ认证,顺利取得Ｂｌｕｅｔｏｏｔｈ
Silicon integrated circuit announced on June 11 its first chip in the field of wireless communications - IC9000 officially listed. IC9000 silicon into the first Bluetooth baseband chip, and on May 17 through TUV’s BQB certification, smooth access to Bluetooth