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简介图形电镀金工艺被广泛应用于线路板生产制作,是由于金层具有特有的属性,包括低接触电阻、防腐蚀以及能抵抗在线路板生产中使用的一般蚀刻剂。图形电镀金工艺最普遍的流程是铜/镍/金。硫酸铜/磺酸镍/酸性金盐化合物是很普
Introduction Graphic gold electroplating processes are widely used in circuit board production due to the unique properties of the gold layer, including low contact resistance, corrosion protection and resistance to common etchants used in circuit board production. The most common process for the pattern gold plating process is copper / nickel / gold. Copper sulfate / nickel sulfonate / acidic gold salt compounds are very general