论文部分内容阅读
超前互连技术公司(AIT)推出两种新型引脚框封装,DFN(双精细间距无引脚)和DFN+(双精细无引脚提高版),它们适合于手机、PDA、笔记本电脑等IC,以替代SOIC、TSOP、TSSOP等小体积封装,并保持管脚兼容。DFN+还允许无源器件集成到引脚框的两侧。这种新型引脚框封装比SO封装具有更好的散热、电性能和机械特性。与分散的IC和无源器件相比,其成本可降低25%。这种新型引脚框封装特别适用射频应用。这种封装
Two new leadframe packages, DFN (Double Fine Pitch No Pins) and DFN + (Double Fine No Pins Upgrade) are available from Advanced Interconnect Technology Corporation (AIT) and are suitable for ICs such as cell phones, PDAs, notebooks, To replace SOIC, TSOP, TSSOP and other small package size, and maintain pin-compatible. DFN + also allows passive components to be integrated on both sides of the leadframe. This new leadframe package offers better thermal, electrical and mechanical properties than SO packages. The cost can be reduced by 25% over discrete ICs and passive components. This new leadframe package is particularly suitable for RF applications. This package