论文部分内容阅读
提出了一种新颖的非致冷光读出热成像芯片的设计 ,其核心部分是一个 m× n的可动微镜阵列 ,可动微镜是由双材料弯折梁及其所支撑的微镜面组成 .在红外辐射的作用下 ,梁发生弯曲带动微镜面发生的位移变化对输出可见光的强度进行调制 ,即利用光调制原理完成光信号转换和增强 .采用体硅 MEMS技术 ,成功地制作出了 5 0×5 0的可动微镜阵列 .测试表明 :工艺一致性和残余应力对释放前后可动微镜表面粗糙度与平整度、可动微镜间初始相位以及可动微镜灵敏度的大小产生了重要影响
A novel design of thermocouple chip for non-photoluminescent readout is proposed. The core of the chip is an m × n movable micromirror array. The movable micromirror consists of a bimaterial bending beam and its supported micromirror Under the action of infrared radiation, the bending of the beam drives the change of the displacement of the micro-mirror surface to modulate the intensity of the output visible light, that is, the light signal conversion and enhancement is realized by using the light modulation principle. The bulk silicon MEMS technology is used to successfully produce 5 0 × 500. The test shows that the process consistency and residual stress before and after release of the movable micro-mirror surface roughness and flatness, the initial phase between the movable micro-mirror and the size of the movable micro-mirror sensitivity Have a significant impact