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根据功率LED的柔性封装要求,提出了基于贴片式(SMD)封装的功率型LED柔性封装结构。对各层结构进行了优化设计,采用有限元分析(FEA),模拟了柔性封装结构LED的热场分布。对比研究了柔性LED与传统封装结构LED的热特性,并对弯曲状态下柔性衬底材料对芯片的应力进行了分析。结果表明,采用金属Cu箔衬底的柔性封装结构,其散热特性较好;Cu/超薄玻璃复合衬底替代Cu箔衬底,可以减少弯曲的应力,减少幅度达到2.5倍,散热特性基本相同。SMD柔性封装的LED不仅具有较好的热稳定性,且具有柔性可挠曲特性,其应用潜力很大。
According to the requirement of flexible LED package, a power LED flexible package based on chip package (SMD) package is proposed. The structure of each layer was optimized and the FEA was used to simulate the thermal field distribution of LED with flexible package structure. The thermal characteristics of flexible LED and conventional package LED were compared, and the stress of the flexible substrate on the chip under bending condition was analyzed. The results show that the flexible package with metal Cu foil has better heat dissipation characteristics. Cu / ultrathin glass composite substrate can reduce the bending stress by 2.5 times and the heat dissipation characteristics are basically the same . SMD flexible encapsulated LEDs not only have good thermal stability, but also have flexible and flexible characteristics, which have great potential applications.