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随着电子工业的飞速发展,对印刷线路板的需要量越来越大。如何寻找一个质量好、成本低、工序简便的方法,已经成为当前急需解决的问题。目前国内外生产线路板有以下几种方法; 一、减法:用有机膜对敷铜板进行选择性掩蔽,再用腐蚀的办法去掉不需要部分,而得到线路。可以用化学腐蚀的方法: 1.Cu+2FeCl_3→CuCl_2+2FeCl_2 2.Cu+2Cl~-→CuCl_2也可以用电腐蚀的办法: Cu—2e→Cu~(++) 二、加法:选择性沉铜或选择性电镀生长而得到线路。 1.选择性沉铜:利用Sn~(++)+hv=Sn~(+4)的原理(或其他光敏元素),将SnCl_2,浸在绝缘板上,进行选择性曝光,曝光部分Sn~(++)成了Sn~(+4),失掉敏化作用,因此无法在常温下沉铜
With the rapid development of the electronics industry, the demand for printed circuit boards is growing. How to find a good quality, low cost, easy process method has become an urgent need to solve the problem. At present, there are several ways to produce printed circuit boards at home and abroad: 1. Subtraction: selectively mask the copper clad laminate with organic film, and then remove the unnecessary parts by etching to obtain the circuit. You can use chemical etching methods: 1.Cu + 2FeCl 3 → CuCl 2 + 2FeCl 2 2.Cu + 2Cl ~ - → CuCl 2 can also be used by the method of electric corrosion: Cu-2e → Cu ~ (++) Second, the addition: selective precipitation Copper or selective plating growth and get the line. 1. Selective copper sinking: By using the principle of Sn ~ (++) + hv = Sn ~ (+4) (or other photosensitive elements), SnCl_2 is immersed in an insulating plate for selective exposure, (++) became Sn ~ (+4), lose sensitization, it can not sink copper at room temperature