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一、引言陶瓷有许多特点,利用这些特点,则可将其与金属进行封接。这一技术很早就得到了发展。远在1930年,德国就开始用陶瓷作电子管外壳,并在第二次世界大战中得到了应用。战后,美国利用德国的技术开展了新的研究,目前已应用于各种电子仪器及设备中。与此同时,日本也大力从事研究。迄今,曾先后提出过不少方法,如加压扩散法、焊接密封法、金属粉末烧结法、活性合金法、分段粉末密封法、电镀法等,其中采用最广泛的是金属粉末烧结法及活性合金法。金属粉末烧结法,亦称钼锰法及德律风根法。该方法需要几道工序。首先,将磨细的钨
First, the introduction of ceramic has many features, the use of these features, it can be sealed with the metal. This technology has long been developed. As far back as 1930, Germany began to use ceramic tube shell, and in the Second World War has been applied. After the war, the United States carried out new research using German technology and has now been applied to various electronic instruments and equipment. In the meantime, Japan is also engaged in research. So far, many methods have been proposed such as pressurized diffusion method, welding sealing method, metal powder sintering method, active alloy method, segmented powder sealing method, electroplating method and the like, of which the most widely used are metal powder sintering method and Active alloy method. Metal powder sintering method, also known as Molybdenum law and Telefunken root method. This method requires several procedures. First, ground tungsten