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电荷耦合器件(CCD)的集成化和高密度镶嵌红外(IR)探测器的成功已经打开了诸如红外焦面工艺这样一种新的技术领域。当焦面面阵的研制工作逐渐转变到生产阶段时,大焦面探测系统引用的新概念以及制造、测试和集成化中的复杂性都需要从单片电路的设计开始对焦面结构进行了解,本文对六种结构面的重要特征进行了简要的叙述,并指出了影响焦面结构的工艺和应用方面的限制。对一般焦面面临的主要问题进行了研究并对焦面结构工艺中的发展趋势进行了探索。
The success of CCD integration and high density IR detectors has opened up a new area of technology such as infrared focal plane technology. When the development of the focal plane array gradually shifted to the production stage, the new concept of large focal plane detection system reference and the complexity of manufacturing, testing and integration need to understand the focal plane structure from the design of the monolithic circuit, This paper briefly describes the important features of the six structural planes and points out the limitations of the technology and application that affect the focal plane structure. The main problems that the general focal plane faces are studied and the development trend of the focal plane structure technology is explored.