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本文论述一种厚/薄铜复合PWB(及其可靠性),它允许PWB设计者在厚铜和薄铜之间以任何希望的图形进行随意选择,以使电源模块/分配电路可以和精细图形特征一起集成,从而适应离I/O数半导体封装的要求。
This article discusses a thick / thin copper composite PWB (and its reliability) that allows the PWB designer to choose between thick copper and thin copper in any desired pattern so that the power supply module / distribution circuit can work with fine patterns The features are integrated together to accommodate the need for I / O count semiconductor packages.