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在新一代电子产品中应用的系统封装(SIP),是将几片大规模集成电路芯片安装在一块高密度布线的印制电路板上,这种印制电路板的线条在20μm以下。作为这种印制电路板基材的关键技术有这样几个方面:为适应高速信号的传输所用低介电常数绝缘层的开发;确保绝缘层与导线的良好粘接以及导线表面粗糙度的降低等。该公司在印制电路用铜箔处理技术方面有一定的优势,例如能处理数十nm水平的粗糙度均匀的铜箔表面;在此基础上开发成功了与低介电常数树脂基材有着良好粘接性的新型铜箔表面处理技术。这种方法主要是在原来的氧化还原处理之前进行一次贵金属处理。表面的粗糙度可达到原来处理的1/10以下,而抗剥强度仍保持在0.6kN/m以上;而且,此项技术也适用于10μm以下线条的印制电路板。得出的板材在85℃,85%相对湿度,DC5V的条件下,1000小时后绝缘性能无异常变化,绝缘可靠性能优异。此项技术今后有望成为高密度印制电路板制造的重要技术保证。
System Packaging (SIP), which is used in the new generation of electronic products, is to mount a few large scale integrated circuit chips on a high-density printed circuit board with lines below 20μm. The key technologies for such printed circuit board substrates include the following: Development of a low dielectric constant dielectric for the transmission of high-speed signals; Ensuring good adhesion of the insulation to the conductor and reduction of the surface roughness of the conductor Wait. The company has some advantages in copper foil processing technology for printed circuits, such as the ability to process copper foil surfaces with uniform roughness on the order of tens of nm; and on the basis of this, it has succeeded in developing a good low-k resin substrate Adhesion of a new type of copper foil surface treatment technology. This method is mainly in the original redox treatment before a precious metal treatment. Surface roughness can reach the original deal with the following 1/10, and peel strength remained at 0.6kN / m above; Moreover, this technology is also suitable for printed circuit boards below 10μm lines. The resulting plate at 85 ℃, 85% relative humidity, DC5V conditions, 1000 hours after the insulation performance without abnormal changes in insulation reliability. This technology is expected to become an important technical guarantee for the manufacture of high-density printed circuit boards in the future.