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目前,以集成电路为代表的微电子学器件用的微细图形,都是由以照相和化学腐蚀相结合的光刻技术制得的。但是随着图形的进一步微细化,在许多情况下要实现高精度的腐蚀很困难。由于水溶液容易使腐蚀表面氧化。化学药品的水溶液又会产生公害,这些构成了化学腐蚀的弱点。一种可以克服化学腐蚀上述弱点的方法是溅射腐蚀。由于这种方法利用离子轰击和活泼的氟化乙稀气体等离子体的化学反应来进行溅射腐蚀的,对于用其它方法很难腐蚀的物质,它都可实现高精度腐蚀,溅射腐蚀的优点是(1)可以对亚微米图形进行极稳定的腐蚀。(2)对铝的腐蚀速度较快。(3)可以腐蚀用化学药品很难腐蚀的二氧化硅和氧化铝等。(4)不会产生公害。溅射腐蚀后的样品表面,经俄歇电子分析没有发现C和Ce原子,这证明腐蚀非常干净,溅射腐蚀用于半导体器件制作工艺最担心的是对器件的损伤,但在制作对轰击损伤非常敏感的MOS器件时,器件的性能同采用化学腐蚀的场合完全相同。溅射腐蚀最有代表性的应用实例是制作集成电路掩膜。它既可满足高密度又可满足高精度的要求,因此是一种腐蚀加工微细图形的有效方法,也必将成为半导体工业中一种不可缺少的重要技术。
At present, micro-electronics devices represented by integrated circuits are made of fine patterns by a combination of photolithography and chemical etching. However, with the further miniaturization of graphics, it is difficult to achieve high-precision etching in many cases. Due to the aqueous solution is easy to make the corrosion surface oxidation. Chemical water solution will produce pollution, which constitutes a chemical corrosion vulnerability. One way to overcome these weaknesses of chemical etching is sputtering. Since this method utilizes ion bombardment and chemical reaction with a live gas of fluorine ethylenic gas to conduct sputter etching, it achieves high-precision etching for substances that are hardly corroded by other methods. The advantages of sputter etching Yes (1) Very stable erosion of submicron patterns. (2) corrosion of aluminum faster. (3) can corrode chemical and other chemicals that are hard to corrode silica and alumina. (4) will not produce pollution. Sputter-corroded sample surfaces, C and Ce atoms were not observed by Auger electron analysis, demonstrating that the etching is very clean. Sputter etching is most concerned with the device fabrication process in semiconductor device fabrication processes, When sensitive MOS devices are used, the performance of the device is exactly the same as it is with chemically etched. Sputter corrosion is the most representative application example is the production of integrated circuit mask. It can meet both high density and high precision requirements, and therefore it is an effective method of etching fine patterns. It will also become an indispensable important technology in the semiconductor industry.