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运用金相方法研究电镀层的组织结构表明:电镀层的主要强化机制是细晶强化,此外,在电镀层中还存在着相当数量的位错和微孪晶。它们对电镀层的镀层强化起着决定性的作用。刷镀Ni镀层与电镀Ni镀层相比,刷镀层具有更高的硬度和耐磨性,这是通过试验得到的结论。有关资料研究结果表明:刷镀快速Ni镀层的强化机制是位错亚结构晶胞
The study of the microstructure of the electroplating layer by the metallographic method shows that the main strengthening mechanism of the electroplating layer is the grain refinement. In addition, there are a considerable amount of dislocations and micro-twins in the plating layer. They play a decisive role in the galvanic coating strengthening. Brush Plating Ni Coating Electroplating Ni coating compared to the brush coating with higher hardness and wear resistance, which is obtained through the test results. Relevant data research results show that: the strengthening mechanism of the rapid plating Ni plating is dislocation sub-unit cell