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在全球大规模推广使用LED照明的今天,使用寿命是制约LED发展的瓶颈,其中,封装材料的线膨胀系数对大功率LED的使用寿命具有重要的影响。由于大功率LED粘接层材料比其相邻材料的线膨胀系数大,在循环工作时各层之间的膨胀收缩不一致,导致层与层之间产生翘曲裂纹现象,从而影响LED的使用寿命。文中采用向环氧树脂(EP)中分别加入氮化硼(BN)、氮化铝(AlN)、碳化硅(SiC)微粉颗粒制备出3种——BN/EP、AlN/EP、SiC/EP复合材料,并对其进行对比分析。研究结果表明,BN/EP复合材料性能最佳,线膨胀系数可降至3.86×10-5 K-1。且当BN质量分数为55%时,导热系数达到1.598 W/(m·K),粘接强度为53.83 MPa。与纯环氧树脂相比,可使1 W LED芯片结温降低约29.6℃,寿命提高约2.2×104 h。
In the global large-scale promotion of the use of LED lighting today, the service life is the bottleneck restricting the development of LED, in which the linear expansion coefficient of packaging materials on the life of high-power LED has a significant impact. As the high-power LED adhesive layer material than its adjacent materials, large linear expansion coefficient in the cycle when the expansion and contraction between the different layers of inconsistencies, resulting in warping cracks between layers and thus affect the life of the LED . In this paper, three kinds of BN / EP, AlN / EP, SiC / EP were prepared by adding BN, AlN and SiC powders to epoxy resin (EP) Composite materials, and comparative analysis. The results show that BN / EP composites have the best performance and the linear expansion coefficient can be reduced to 3.86 × 10-5 K-1. When the mass fraction of BN is 55%, the thermal conductivity reaches 1.598 W / (m · K) and the bonding strength is 53.83 MPa. Compared with pure epoxy resin, 1 W LED chip junction temperature can be reduced by about 29.6 ℃, life expectancy increased by about 2.2 × 104 h.