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国际半导体数据统计机构SICAS近期的统计数据中,表示采用MOS工艺以8英寸等值硅片计,另一类工艺为双极工艺,通常用在模拟电路中。除了标有300 mm硅片MOS之外,双极数据以5英寸等值硅片计,而分立器件以6英寸等值硅片计。总的半导体SC数据,包括双极数据由5英寸转换成8英寸利用转换率0.391及分立器件由6英寸转换成8英寸,利用转换率0.563。所有数据的时间段在2007Q1至2010Q1,包括产能、实际产出及产能利用率,代工的产能单列。产能是按线宽尺寸即小于8英寸、200 mm(8英寸)及300
Recent statistics from SICAS, an international semiconductor data statistics agency, show that MOS technology is based on 8-inch wafers and the other is bipolar, which is commonly used in analog circuits. Bipolar data was measured on a 5-inch equivalent wafer except for the 300 mm silicon MOS, while the discrete device was on a 6-inch equivalent wafer. The total semiconductor SC data, including the conversion of bipolar data from 5 inches to 8 inches using a conversion rate of 0.391 and discrete devices from 6 inches to 8 inches, utilizes a conversion rate of 0.563. All data in the period 2007Q1 to 2010Q1, including capacity, actual output and capacity utilization, OEM capacity alone. Capacity is less than 8 inches in line width, 200 mm (8 inches) and 300 in capacity