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２００１年１１月２６日，飞利浦半导体公司与华为技术有限公司宣布合作开发３G核心ASIC套片。此次，飞利浦半导体与华为签订的ASIC合作开发协议，进一步证实了飞利浦半导体对强化中国通信市场技术和资金投入的承诺；以及华为公司在３G研发及市场方面全方位满足客户需求的能力
November 26, 2001, Philips Semiconductors and Huawei Technologies Co., Ltd. announced the cooperation to develop 3G core ASIC chipsets. This time, Philips Semiconductors and ASIC signed a cooperation agreement to further confirm the Philips Semiconductors to strengthen China’s communications market, technology and capital commitment and Huawei’s 3G R & D and marketing capabilities to meet customer needs in all aspects