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以双马来酰亚胺树脂(BMI)为树脂基体,二烯丙基双酚A(DABA)为增韧剂,γ-缩水甘油醚氧丙基三甲氧基硅烷(KH-560)表面改性的Si C颗粒-Si C晶须(Si CP-Si CW)为复配导热填料,浇注成型制备Si CP-Si CW/BMI导热复合材料,分析研究Si C形状、用量、复配及表面改性对Si CP-Si CW/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明,当改性Si CP-Si CW用量为40wt%且Si CP:Si CW质量比为1:3时,Si CP-Si CW/BMI导热复合材料具有最佳的综合性能,导热系数λ为1.125 W/m K,介电常数ε为4.12,5%热失重温度T5为427oC。
The surface modification of γ-glycidoxypropyltrimethoxysilane (KH-560) with bismaleimide resin (BMI) as resin matrix, diallylbisphenol A (DABA) as toughening agent Of Si C particles -Si C whiskers (Si CP-Si CW) for the composite thermal conductive filler, pour molding Si CP-Si CW / BMI thermal conductivity composite materials, analysis of Si C shape, dosage, compound and surface modification On the thermal conductivity, dielectric properties, mechanical properties and thermal properties of Si CP-Si CW / BMI thermal conductive composites. The results show that the Si CP-Si CW / BMI thermal conductive composite has the best overall performance when the amount of modified Si CP-Si CW is 40 wt% and the mass ratio of Si CP: Si CW is 1: 3. The thermal conductivity λ is 1.125 W / m K, dielectric constant ε 4.12, 5% weight loss temperature T5 427oC.