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圆片级封装(WLP)具有尺寸小、散热性能好、封测成本低等优点,广泛应用于便携式电子产品,其在跌落、碰撞等环境下的可靠性越来越受到重视。将WLP器件组装到PCB基板上,按照JEDEC电子产品板级跌落实验标准进行实验,研究了WLP元件引脚节距、焊球尺寸、PCB焊盘工艺等因素对样品可靠性的影响。对失效样品进行了切片制样,通过金相显微镜、能量色散X射线光谱(EDX)和扫描电子显微镜进行了分析,研究了WLP器件失效机理及其与器件焊球尺寸、节距之间的关系,讨论了底部填充料对WLP封装可靠性的改进作用。
Wafer-level package (WLP) has the advantages of small size, good heat dissipation and low cost of IC packaging and testing. It is widely used in portable electronic products and its reliability in dropping, collision and other environments is getting more and more attention. The WLP device is assembled on a PCB substrate. Experiments are conducted according to the board drop test standard of JEDEC Electronics, and the influence of the WLP component pin pitch, the size of the solder ball, the PCB pad process and other factors on the reliability of the sample is studied. Failure samples were sectioned and analyzed by optical microscope, energy dispersive X-ray spectroscopy (EDX) and scanning electron microscopy (SEM). The failure mechanism of WLP device and its relationship with the solder ball size and pitch were studied , Discussed how the underfill can improve the reliability of the WLP package.