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以DADGEBA(烯丙基双酚A型环氧树脂)和DADGEBAES(烯丙基双酚A型环氧树脂-环硫树脂)分别作为基体树脂,以T33(酚醛胺类化合物)作为固化剂,制备相应的胶粘剂。采用在线FT-IR(红外光谱)法、DSC(差示扫描量热)法和Arrhenius方程对两种体系固化过程的特征吸收峰、放热焓和表观活化能等进行了表征和分析,并采用计算机软件模拟法计算出两种树脂单聚体的福井函数。研究结果表明:DADGEBAES/T33体系中的环硫基比DADGEBA/T33体系中的环氧基更易反应,前者的固化反应放热焓和表观活化能均小于后者;DADGEBAES中环硫基的福井函数分布多于DADGEBA中环氧基的福井函数分布,说明前者的反应活性更高。
DADGEBA (allyl bisphenol A type epoxy resin) and DADGEBAES (allyl bisphenol A type epoxy resin - ring sulfur resin) were used as matrix resin and T33 (phenalkamine) as curing agent respectively to prepare The corresponding adhesive. The characteristic absorption peaks, exothermic enthalpies and apparent activation energies of the two systems were characterized and analyzed by on-line FT-IR (infrared spectroscopy), DSC (differential scanning calorimetry) and Arrhenius equations The Fukui function of two kinds of resin monomers was calculated by computer software simulation. The results show that the epithio groups in DADGEBAES / T33 system are more reactive than the epoxy groups in DADGEBA / T33 system, the ex ent enthalpy and apparent activation energy of the former are less than the latter. The Fuki function of epithio group in DADGEBAES The distribution of Fukui function more than the epoxy group in DADGEBA shows that the former has higher reactivity.