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在焊点间距和焊球尺寸进一步微型化、芯片面积进一步增大趋势的推动下,器件的可靠性也正在被推向尽头。以致不采用应力缓冲再分布层就越来越难以保障可靠性的实现。因此,提供一种即具有高性能又便于工艺加工的单一材料便成为材料供货商的追求目标。在封装领域所期盼的这些要求中,DowCorningCorp.正在开发一族可制做图形的硅酮基材料。这族材料由一系列的旋涂型光学作图材料以及第二系列的丝网印刷材料组成。此材料除了具有封装用途的性质之外,还具有类似的低潮湿摄取、高温稳定性、良好的电气性能及对普通材料的最佳附着力。
In solder joint spacing and solder ball size further miniaturization, the chip area to further promote the trend of the promotion, the device reliability is also being pushed to the end. So it is more and more difficult to guarantee the realization of reliability without stress buffer redistribution layer. Therefore, it is the goal of the material supplier to provide a single material that has high performance and is easy to process. Among the requirements expected in the packaging arena, Dow Corning Corp. is developing a family of customizable silicone-based materials. This family of materials consists of a series of spin-on optical mapping materials and a second series of screen printing materials. In addition to its encapsulated nature, this material offers similar low moisture uptake, high temperature stability, good electrical properties and optimum adhesion to common materials.