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硅微机械力敏器件在封装时往往采用硅—玻璃静电键合的方法。但在静电键合时静电力也往往作用于不需要键合的结构部分。并可能引起这些结构的畸变，造成器件特性劣化或破坏。本文分析了静电力的这些影响，并结合实践提出了一些解决方法
Silicon micro-mechanical force devices in the package often use silicon - glass electrostatic bonding method. However, static electricity also tends to act on the structural parts that do not require bonding during electrostatic bonding. And may cause distortion of these structures, resulting in degradation or destruction of the device characteristics. This paper analyzes these effects of electrostatic force, and puts forward some solutions in combination with practice