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研究了杂质元素铅、铋对银基钎料铺展性能和接头强度的有害影响,并通过对钎料显微组织、钎料表面的低熔点先熔析出物以及钎料铺展表面状态的分析,揭示了杂质元素铅、铋在银基钎料中的作用机理。
The detrimental effects of lead and bismuth, which are impurity elements, on the spreading performance and joint strength of silver-based solder were studied. The microstructure of the solder, the low melting point premelted precipitate on the solder surface and the spreading state of the solder were revealed. The impurity elements lead, bismuth in silver-based solder in the mechanism of action.