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研究了不同固溶工艺条件对Cu-1.4Ni-1.2Co-0.6Si合金显微组织的影响,对合金固溶-时效后的显微硬度和导电率进行了分析,并采用电子衍射及透射电镜分析其显微组织。结果表明:合金铸态组织以等轴晶为主,热轧变形组织中存在许多细小析出相。热轧合金在固溶处理过程中基体变形组织发生再结晶和晶粒长大,且随着固溶温度升高,析出相固溶量增加,至975℃时,析出相粒子基本回溶到基体中。合金中的析出相与Cu-Ni-Si合金具有相同的结构和形貌,与Cu基体的位向关系为:[001]Cu//[110]p,(010)Cu//(001)p;[112]Cu//[32 4]p,(110)Cu//(2 11)p。合金最佳固溶-时效处理工艺为975℃×1.5 h+500℃×4 h时效,在此工艺条件下,合金显微硬度为232 HV,相对导电率为49%IACS。
The effects of different solution treatment conditions on the microstructure of Cu-1.4Ni-1.2Co-0.6Si alloy were studied. The microhardness and electrical conductivity of the alloy after solution-aging were analyzed. Analyze its microstructure. The results show that the as-cast alloy is mainly composed of equiaxed grains, and there are many fine precipitates in hot-rolled deformed structure. The hot deformation of the hot rolled alloy during the solution treatment occurred recrystallization and grain growth, and with the increase of solution temperature, the amount of solid solution in the precipitated phase increased. At 975 ℃, the precipitated phase particles were almost dissolved back into the matrix in. The precipitated phase in the alloy has the same structure and morphology as that of the Cu-Ni-Si alloy, and the orientation relationship with the Cu matrix is [001] Cu // [110] p, (010) Cu // (001) p ; [112] Cu // [32 4] p, (110) Cu // (2 11) p. The optimum solution-aging treatment of the alloy is 975 ℃ × 1.5h + 500 ℃ × 4h aging. Under these conditions, the microhardness of the alloy is 232 HV and the relative electrical conductivity is 49% IACS.