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通过添加不同厚度的Ag中间层,采用真空扩散焊工艺进行Cu/Al异质金属连接。利用扫描电镜(SEM)及能谱仪(EDS)对界面的元素分布及相组成进行分析,采用剪切试验及电化学腐蚀能测试对异质复合接头力学及耐腐蚀性能进行了分析。结果表明,Ag中间层可以有效抑制Al和Cu界面生成脆性金属间化合物相,Ag以较快的方式扩散进入Al基体的晶界中。界面上生成宽度较窄的Cu、Al化合物。与Cu/Al直接连接相比,添加Ag箔的界面电化学腐蚀电位有明显提升,表明Ag元素的添加有效改善了Cu/Al接触界面的耐腐蚀性能。
By adding Ag intermediate layers with different thicknesses, Cu / Al heterogeneous metal connections were made by vacuum diffusion welding. The elemental distribution and phase composition of the interface were analyzed by scanning electron microscope (SEM) and energy dispersive spectrometer (EDS). The mechanical and corrosion resistance of heterogeneous composite joints were analyzed by shear test and electrochemical corrosion test. The results show that the Ag intermediate layer can effectively suppress the formation of brittle intermetallic phases at the interface between Al and Cu, and Ag diffuses into the grain boundaries of Al matrix in a faster way. Interface to generate a narrow width of Cu, Al compounds. Compared with the Cu / Al direct connection, the electrochemical corrosion potential at the interface of the Ag foil was significantly improved, indicating that the addition of Ag element effectively improves the corrosion resistance of the Cu / Al contact interface.