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《中国电子报》消息:目前,马来西亚第二大芯片封装测试商友尼森公司投资2.1亿美元,在成都高新西区建设芯片封装与测试工厂。这是仅次于英特尔的投资金额,成为成都第二大芯片封装与测试工厂。友尼森成都工厂明年一季度开建,2006年一季度投产项目建成后员工总数将达4500至5600人。据友尼森高层透露,他们将把成都工厂打造成友尼森在全球的旗舰企业。
“China Electronics News” message: At present, Malaysia’s second-largest chip packaging and testing business unit Nexen invested 210 million US dollars in the construction of high-tech west of Chengdu chip packaging and testing plants. This is second only to Intel’s investment amount, becoming Chengdu’s second largest chip packaging and testing plant. Younison Chengdu plant opened in the first quarter of next year, put into operation in the first quarter of 2006 the total number of employees will reach 4500-5600 after the completion of the project. According to the top executives of UNISON, they will set up Chengdu Plant as the global flagship enterprise of UNISON.