Low-voltage Electromagnetic Compaction of Metal and Ceramic Powders

• 作 者: MENG Zhenghua HUANG Shangyu SU
• 机 构: SchoolofMaterialsScienceandEngineering
• 出 处: 武汉理工大学学报：材料科学英文版
• 发表日期: 2007年4期
• 关键词: 散剂 低电压 电磁压实 密度 金属复合材料 陶瓷复合材料 powder low-voltage electromagnetic compaction de
• 基金项目: Funded by the National Natural Science Foundation of China （No.50375114） and State Key Laboratory of Plastic Forming Simulation and Die ＆ Mould Technology （No.05-03）

<正>Low-voltage electromagnetic compaction(EMC)was used to compact metal powders (Cu)and ceramic powders(TiO_2)in the indirect way.It was found that the density of the metal powder parts compacted by low-voltage EMC varied linearly with the dischargi