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一绪言大规模集成电路的实现,给电通信和计算机生产部门等带来的影响,无疑具有革命的因素,这已为许多人所关注,并寄与极大的期望。然而,这仅是就大规模集成电路的利用方面而言的,从制造技术的角度来看,与普通的半导体制造技术相比,就不一定非建立起系统完全不同的新技术不可。即认为,除去有关工艺的干式化、使用电子束和X射线等曝光方式需另行研究之外,其他工艺主要的是在原有半导体制造技术的基础上加以发展就可以了。
First of all, the impact of the realization of large-scale integrated circuits, power supply and telecommunications and computer production departments undoubtedly have a revolutionary element, which has attracted the attention of many people and sent them with great expectations. However, this is only for the use of large scale integrated circuits. From a manufacturing point of view, it is not necessary to establish a completely different new technology than the conventional semiconductor manufacturing technology. That is to say, in addition to the dry process, the use of electron beam and X-ray exposure methods need to be studied separately, the other process is mainly based on the original semiconductor manufacturing technology to be developed on it.