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利用单辊甩带法制备成分为(原子分数,%)Cu_(68.6)P_(14)Ni_(13)Sn_4Si_(0.4)的铜磷基非晶钎料。采用X射线衍射分析、差示扫描量热分析、扫描电镜分析等方法研究非晶钎料的显微组织、熔化特性、润湿性和钎焊性能,并与HL201和HL205两种普通市场钎料的相应性能进行了了对比。结果表明:铜磷基非晶钎料较铜磷市场钎料的显微组织均匀、熔化温度明显降低、熔化区间小、润湿性好,有利于提高钎焊接头性能。
The Cu-P amorphous filler with Cu 68.6 P 14 Ni 13 Sn 4 Si 0.4 (atomic fraction) was prepared by single roll rejection method. X-ray diffraction analysis, differential scanning calorimetry, scanning electron microscopy and other methods were used to study the microstructure, melting properties, wettability and brazing properties of amorphous brazing filler metal. The results were compared with those of HL201 and HL205 The corresponding performance has been compared. The results show that the microstructure of copper-phosphorus-based amorphous filler metal is more uniform than that of copper-phosphorus filler metal, the melting temperature is obviously reduced, the melting range is small and the wettability is good, which is beneficial to improve the performance of brazed joint.