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TSMC(台湾集成电路)、UMC(联电)、PSC(力晶)等台湾半导体厂家预定2001年底逐渐开始生产φ300mm 硅片。为了能够确保日本和美国的半导体厂家和设计公司委托的生产量,通过合资和共同开发的形式,逐渐确立起与上述台湾半导体厂家之间的协作环境。对于与世界上φ300mm 硅片相对应的半导体厂家来说,台湾正在变成试生产的实验场和生产基地。对于 TSMC 来说,由于半导体工厂生产奶φ300mm硅片会冒很大风险,因此他们可望与具有 IC 设计公司和高水平生产技术的美国半导体厂家合作起来共同开发新产品,并可望工厂在生产φ300mm 硅片时能提高
TSMC (Taiwan Semiconductor Manufacturing Co., Ltd.), UMC (UMC), PSC (Powerchip) and other semiconductor manufacturers in Taiwan are scheduled to begin production of φ300mm silicon by the end of 2001. In order to ensure that Japan and the United States of semiconductor manufacturers and design companies commissioned by the amount of production through joint ventures and joint development of the form, and gradually establish a collaborative environment with the above Taiwanese semiconductor manufacturers. For the semiconductor manufacturers that correspond to φ300mm silicon in the world, Taiwan is becoming the experimental field and production base for trial production. TSMC is likely to be working with US semiconductor companies that have IC design houses and high-level manufacturing technologies to jointly develop new products due to the high risk of producing φ300mm silicon wafers at the semiconductor plant, φ300mm silicon can improve