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采用高功率脉冲磁控溅射技术在M2高速钢基体上沉积了TiN薄膜,研究了不同脉冲电流下TiN膜层的沉积速率、膜基结合力、晶体生长取向、纳米硬度和摩擦磨损性能等。结果表明:随着脉冲电流的增加,膜层沉积速率不断增大,膜层致密度逐渐增强。当脉冲电流增加到20A以上时膜层沿着(111)面择优生长并且具有最高的I_(111),这与能流密度效应有关。脉冲电流为20A时的膜层表面具有最高的硬度(可达25GPa)、最高的膜基结合力(可达70N,压痕评定优于HF2)和较好的耐摩擦磨损性能。
TiN thin films were deposited on M2 high speed steel substrate by high power pulsed magnetron sputtering. The deposition rate, film-based bonding, crystal growth orientation, nano-hardness and friction and wear properties of TiN films under different pulse currents were studied. The results show that with the increase of pulse current, the film deposition rate increases and the film density increases gradually. When the pulse current increases above 20A, the film grows preferentially along the (111) plane and has the highest I_ (111), which is related to the energy flux density effect. When the pulse current is 20A, the surface of the film has the highest hardness (up to 25GPa), the highest film-based adhesion (up to 70N, indentation evaluation is better than HF2) and better wear and abrasion resistance.